Washington Higher Education Facilities Authority


CUSIP 939781G87
  • Issue Currency: United States of America Dollars
  • Announcement Date: 05-Mar-2015
  • News: Washington Higher Education Facilities Authority has issued USD 2805M, 4% Fixed rate bond due 01-Apr-2013. For Bond Document please visit www.BondPDF.com
CUSIP 939781C99
  • Issue Currency: United States of America Dollars
  • Announcement Date: 12-Dec-2017
  • News: Seattle University (the University) is considering borrowing the proceeds of the proposed Washington Higher Education Facilities Authority Refunding Revenue Bonds (Seattle University Project), Series 2017 (the Bonds). If market conditions are favorable, the Bonds may be issued to advance refund and defease all of the outstanding Washington Higher Education Facilities Authority Revenue Bonds (Seattle University Project), Series 2009 totaling $41,775,000 in par amount, and to pay the costs of issuing the Bonds. The University anticipates that the Bonds will be priced on December 19, 2017, through an underwriting by George K. Baum & Company. If the Bonds are issued: The Bonds will be issued under and secured by an Indenture of Trust (the Indenture) between the Washington Higher Education Facilities Authority (the Authority) and U.S. Bank National Association, as trustee (the Trustee); The Bonds will be special, limited obligations of the Authority payable solely from the sources pledged in the Indenture, which will consist primarily of payments that will be required to be made by the University (Loan Payments) under a Loan Agreement by and among the Authority, the Trustee and the University;
CUSIP 939781C81
  • Issue Currency: United States of America Dollars
  • Announcement Date: 14-Nov-2017
  • News: Seattle University (the University) is considering borrowing the proceeds of the proposed Washington Higher Education Facilities Authority Refunding Revenue Bonds (Seattle University Project), Series 2017 (the Bonds). If market conditions are favorable, the Bonds may be issued to advance refund and defease all of the outstanding Washington Higher Education Facilities Authority Revenue Bonds (Seattle University Project), Series 2009 totaling $41,775,000 in par amount, and to pay the costs of issuing the Bonds. The University anticipates that the Bonds will be priced on December 19, 2017, through an underwriting by George K. Baum & Company. If the Bonds are issued: The Bonds will be issued under and secured by an Indenture of Trust (the Indenture) between the Washington Higher Education Facilities Authority (the Authority) and U.S. Bank National Association, as trustee (the Trustee); The Bonds will be special, limited obligations of the Authority payable solely from the sources pledged in the Indenture, which will consist primarily of payments that will be required to be made by the University (Loan Payments) under a Loan Agreement by and among the Authority, the Trustee and the University;



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